Material:

  • Hi Tg & Standard FR-4
  • BT
  • Rogers
  • Polyimide
  • Getek & Getek II
  • Teflon
  •  

    Finish:

  • HASL
  • Immersion Gold
  • Immersion Silver
  • Immersion Tin
  • Nickel
  • OSP (Entek & Shikoku)

Feature:

  • 0.003″ Min. Lin Width
  • 0.003″ Min. Spacing
  • 0.003″ Layer to Layer
  • +/- 7% PCB Thickness
  • +/- 0.005 Profile Dimensions
  •  

    Drilling:

  • 0.006″ Finished Hole Size
  • +/- 0.002″ Hole Tolerance
  • 18:1 Max. Aspect Ratio

    Other Capabilities:

  • Single & Double Sided
  • Multi Layer up to 32 Layers
  • Sequential Lamination
  • 28″x21′ Max. Panel Size
  • 0.014″ Min. Board Thickness
  • Max Core Thickness
  • 6 oz. Max. Copper Weight
  • LPI Solder Mask
  • Solder Mask Colors Available: Green, Red, Blue, Black, and Clear

    Material:

    DuPont Pyralux:

  • DuPont AP Copper Clad Laminates
  • DuPont LF & RF Coverlays & Bonding Plys
  • Hitachi:

  • Polyimide Laminates
  • Polyimide No-Flow Prepreg
  • Arlon:

  • Laminates & No-Flow Prepreg
  • Isola:

  • Laminates & No-Flow Prepreg

Feature:

  • Layer Count:                   4-32
  • Board Thickness:            0.006″/0.002″
  • Internal Imaging:            0.002″/0.002″
  • Min. Dielectric:                0.001″
  • Min. Copper:                   9 Micron
  • Min. Drilled Hole:            0.006″
  • Min. Laser Via:                0.004″
  • Aspect Ratio:                  >10:1
  • PTH Tolerance:                +/-0.002″
  • Impedance Tolerance:      +/- 5%

    Certificates & Accreditations:

  • Mil-PRF-31032
  • Mil-P-50884
  • Mil-P-55110
  • ISO 9001-2000
  • ISO 9001-2008
  • ITAR Registered